JournalPapers_022

Koh Johguchi, Teruyoshi Hatanaka, Koichi Ishida, Tadashi Yasufuku, Makoto Takamiya, Takayasu Sakurai and Ken Takeuchi, “Through-Silicon-Via (TSV) design for a 3D-Solid-State-Drive (SSD) System with Boost Converter in a Package,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, no. 2, pp. 269-277, February 2011.

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