InternationalConference_179

Tomoaki Yamada, Atsuya Suzuki, Yusuke Sugiyama, Chihiro Matsui and Ken Takeuchi, “Comprehensive Analysis on SCM Specifications for High-Performance SCM/NAND Flash Hybrid SSD with Through-Silicon Via,” International Conference on Electronic Packageing (ICEP), pp. 268-271, April 20, 2017.

filed under: