Takahiro Onagi, Chao Sun and Ken Takeuchi, “Impact of Through-Silicon Via Technology on Energy Consumption of 3D-Integrated Solid-State Drive Systems,” International Conference on Electronic Packageing (ICEP), pp. 215-218, April 2015.
Takahiro Onagi, Chao Sun and Ken Takeuchi, “Impact of Through-Silicon Via Technology on Energy Consumption of 3D-Integrated Solid-State Drive Systems,” International Conference on Electronic Packageing (ICEP), pp. 215-218, April 2015.
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